Lattice Boltzmann Study of Vortex Street in Pressurized Underfill Manufacturing Process
Journal of Industrial Engineering Research, 1(10) Special 2015, Pages: 30-36
7 Pages Posted: 10 Jul 2017
Date Written: October 17, 2015
Abstract
Background: This paper studies the effect of solder ball placements and number on the formation of Von Karman vortex street in a pressurized underfill encapsulation process using microscale Lattice Boltzmann based code. This creation of vortex street could lead to vibration as a result of continuous creation of side wall vortices. Based on the findings, increasing the number of solder ball reduces the formation of vortex street. In addition, by placing the solder balls at-center during the manufacturing process could reduce the formation of vortex street.
Keywords: Lattice Boltzmann Method, Vortex Street, Pressurized Underfill
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